1、measuring pressure range:(0 ~ 1.47)MPa
2、voltage supply:DC24V
3、maximum input current:8mA(max)
4、output current:1mA(max)
5、operation temperature:(-40 ~75)℃,storage temperature:(-40 ~85)℃
6、safety torsion:9.8N.m±1N.m
7、safety pressure:2MPa,breaking pressure:3MPa
The technology we use:
1.Silicon piezoresistance technology is realized by the piezoresistance characteristics of semiconductors. The piezoresistance characteristics of semiconductor materials depend on factors such as material type, doping concentration and crystal orientation. This technology can be realized by semiconductor technology, and has the advantages of small size, high output, low cost, and high signal output sensitivity. The disadvantages are mainly reflected in the low tolerance of medium, poor temperature characteristics and poor long-term stability. It is common in the range of medium and low pressure, such as 5kPa~700kPa. The industry also has plans to improve the dielectric tolerance of silicon piezoresistive technology through special packaging processes, such as oil filling, back pressure and other technologies, but it will also cause problems such as significant increase in costs.
2.The ceramic capacitor technology adopts a fixed ceramic base and a movable ceramic diaphragm structure. The movable diaphragm is sealed and fixed with the base by means of glass paste. The electrode pattern is printed on the inside of the two to form a variable capacitance. When the dielectric pressure on the diaphragm changes, the capacitance between the two will change accordingly. The signal will be converted and conditioned by the conditioning chip and then output to the later stage for use. Ceramic capacitor technology has the advantages of moderate cost, wide range, good temperature characteristics, consistency and long-term stability.
3.The glass micro-melting technology adopts the high-temperature sintering process and combines the silicon strain gauge with the stainless steel structure. The four equivalent resistances of the silicon strain gauge form the Wheatstone bridge. When there is dielectric pressure on the other side of the stainless steel diaphragm, the stainless steel diaphragm produces small deformation to cause the bridge change, forming a voltage signal proportional to the pressure change. The glass micro-melting process is difficult to realize and costly. The main advantages are good dielectric resistance and strong overload resistance. It is generally applicable to high and ultra-high voltage ranges, such as 10MPa~200MPa, and its application is relatively limited.