Features
Glass passivated chip junction
Ideal for surface mounted applications
Low leakage
High forward surge current capability
High temperature soldering guaranteed:
260℃/10 seconds at terminals
Mechanical Data
Case: Molded plastic body
Epoxy: UL94V-0 rate flame retardant Polarity: Molded on body
LeadP: Plated terminals solderable per MIL-STD-202E
method 208C
Weight: 0.039 ounce, 1.1gram
Maximum Ratings and Electrical Characteristics
Ratings at 25℃ ambient temperature unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load
For capacitive load derate current by 20%