Features
Glass passivated chip junction
Ideal for surface mounted applications
Low leakage
High forward surge current capability
High temperature soldering guaranteed:
260℃/10 seconds at terminals
Mechanical Data
Case:Molded plastic body
Epoxy:UL94V-0 rate flame retardant
Polarity:Molded on body
LeadP:Plated terminals solderable per MIL-STD-202E method 208C
Weight:0.039 ounce,1.1gram
Maximum Ratings and Electrical Characteristics
Ratings at 25℃ ambient temperature unless otherwise specified
Single Phase,half wave,60HZ,resistive or inductive load
For capacitive load derate current by 20%